Sam Arditi is Vice President of the Mobility Group and General Manager of the Mobile Wireless Group for Intel Corporation. Previously, he was VP and GM of Analog Radio Operation at Intel Corporation, and prior to that, was responsible for new business creation, Intel Capital investments, Intel portfolio companies, and mergers and acquisitions in the wireless communications area. Mr. Arditi joined Intel in 1999 through the acquisition of DSP Communications. He was co-founder of CTP Systems, which merged with DSPC. Mr. Arditi received a bachelor's degree in Electrical Engineering from Ben-Gurion University.
Amos Ben-Meir is the Director of Engineering, Agami Systems, Inc, a Network Attached Storage Company. Amos has over 20 years experience in the Semiconductor, Systems and EDA Industries. Amos was Interim Vice President of Engineering at Xambala - a Layer 7 Hardware Acceleration company. Before that, Amos was a Semiconductor Industry Executive at Telesoft Partners - a Venture Capital firm. Before joining Telesoft, Amos was Director of ASIC Engeineering at Redback Networks (by way of Siara Systems acquisition). Amos currently serves on the Adivsory Boards of Synchronous-DA and Xambala. Amos was on the Advisory Boards of Aarhoi Networks (prior to its acquisition by Emulex) and of VxTel (prior to its acquisition by Intel). Amos has a BSEE from the Technion.